近年來由於電子業的快速發展，半導體產業已成為各國政府極力推動的重要產業之一，而產、官、學界更是積極的投入龐大資源來進行半導體產業相關技術的研究與發展，然而，半導體產業在投入龐大的研發資源條件下，便會衍生出經營效率的問題，即應該要如何善用資源，達到產出利潤最大化或投入成本最小化目標與各廠商之效率的差異與優勢。因此，本計畫採用資料包絡分析法(Data Envelopment Analysis; DEA)，透過DEA來處理多投入及多產出之效率問題，並以多階段的方式來衡量半導體產業之晶圓製造廠商的經營效率之分析，研究期間將以台灣2002年首度開放8吋晶圓赴大陸投資政策為時間基準，前後各6年(即1996-2008年)。分析結果得到，從樣本中分析出最具營運優勢的是台積電與元隆電。經由多階段DEA模式可以更清楚地看出各半導體廠商在不同階段之優勢及劣勢，進而據以擬定其經營策略，以作為提供半導體產業未來經營方針及提升效率之參考依據。

The purpose of this study is based on Data Envelopment Analysis (DEA) concept, and then integrates multi-stage model to construct an efficiency evaluation model for measure the semiconductor industry’s wafer fabrication in Taiwan. The period of this study will focus on the time period at the policy of Taiwan opened investments of the 8 inch wafer to China, 6 years before this policy and 6 years after this policy (1996-2008). Finally, in results of this study, TSMC and AMPI are having high efficiency in wafer fabrication industry. Through this multi-stage DEA can understand the performance, improvement range and aspect of semiconductor industry’s wafer fabrication in Taiwan. Importantly, the proposed model can assist decision makers or administrators of wafer fabrication in assessing the performance, improving applicability for academic and commercial purposes.