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題名:建構彩色濾光膜及微透鏡缺陷樣型分析之資料挖礦架構
書刊名:資訊管理學報
作者:陳暎仁簡禎富黃馨滿
作者(外文):Chen, Ying-jenChien, Chen-fuHuang, Hsin-man
出版日期:2016
卷期:23:2
頁次:頁129-153
主題關鍵詞:彩色濾光膜及微透鏡製程缺陷樣型資料挖礦大數據分析關聯規則製造智慧工業3.5Color filter and microlens processDefect patternData miningBig data analyticsAssociation rulesManufacturing intelligenceIndustry 3.5
原始連結:連回原系統網址new window
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  • 被引用次數被引用次數:期刊(0) 博士論文(0) 專書(0) 專書論文(0)
  • 排除自我引用排除自我引用:0
  • 共同引用共同引用:16
  • 點閱點閱:44
期刊論文
1.Braha, D.、Shmilovici, A.(2002)。Data mining for improving a cleaning process in the semiconductor industry。IEEE Transactions on Semiconductor Manufacturing,15(1),91-101。  new window
2.Chien, C.-F.、Wang, W. C.、Cheng, J. C.(2007)。Data mining for yield enhancement in semiconductor manufacturing and an empirical study。Expert Systems with Applications,33(1),192-198。  new window
3.Hsu, Shao-Chung、Chien, Chen-Fu(2007)。Hybrid data mining approach for pattern extraction from wafer bin map to improve yield in semiconductor manufacturing。International Journal of Production Economics,107(1),88-103。  new window
4.彭金堂、張盛鴻、簡禎富、楊景晴(20051000)。建構關聯規則資料挖礦架構及其在臺電配電事故定位之研究。資訊管理學報,12(4),121-141。new window  延伸查詢new window
5.雷良煥、黃吉成、徐永珍(20100200)。後來居上的CMOS影像感測器。物理,32(1),24-29。  延伸查詢new window
6.Bi, X.、Zhuang, C.、Ding, H.(2009)。A new Mura defect inspection way for TFT-LCD using level set method。IEEE Signal Processing Letters,16(4),311-314。  new window
7.Casali, A.、Ernst, C.(2012)。Discovering correlated parameters in semiconductor manufacturing processes: a data mining approach。IEEE Transactions on Semiconductor Manufacturing,25(1),118-127。  new window
8.Chen, A.、Hong, A.(2010)。Sample-efficient regression trees (SERT) for semiconductor yield loss analysis。IEEE Transaction on Semiconductor Manufacturing,23(3),358-369。  new window
9.Chen, L. F.、Su, C. T.、Chen, M. H.(2009)。A neural-network approach for defect recognition in TFT-LCD photolithography process。IEEE Transactions on Electronics Packaging Manufacturing,32(1),1-8。  new window
10.Chen, Ying-jen、Lin, Tzu-hsiang、Chang, Kuo-hao、Chien, Chen-fu(20131200)。Feature Extraction for Defect Classification and Yield Enhancement in Color Filter and Micro-Lens Manufacturing: An Empirical Study。工業工程學刊,30(8),510-517。new window  new window
11.Chien, C.-F.、Chang, K.-H.、Wang, W.-C.(2014)。An empirical study of design-of-experiment data mining for yield-loss diagnosis for semiconductor manufacturing。Journal of Intelligent Manufacturing,25(5),961-972。  new window
12.Chien, C. F.、Chen, Y. J.、Hsu, C. Y.(2015)。A novel approach to hedge and compensate the critical dimension variation of the developed-and-etched circuit patterns for yield enhancement in semiconductor manufacturing。Computers & Operations Research,53,309-318。  new window
13.Chien, C. F.、Chen, Y. J.、Hsu, C. Y.、Wang, H. K.(2014)。Overlay error compensation using advanced process control with dynamically adjusted proportional-integral R2R controller。IEEE Transactions on Automation Science and Engineering,11(2),473-484。  new window
14.Chien, Chen-Fu、Chuang, Shih-Chung(2014)。A framework for root cause detection of sub-batch processing system for semiconductor manufacturing big data analytics。IEEE Transactions on Semiconductor Manufacturing,27(4),475-488。  new window
15.Chien, C.-F.、Hsu, C. Y.(2014)。Data mining for optimizing IC feature designs to enhance overall wafer effectiveness。IEEE Transactions on Semiconductor Manufacturing,27(1),71-82。  new window
16.Chien, C. F.、Hsu, C. Y.、Chen, P. N.(2013)。Semiconductor fault detection and classification for yield enhancement and manufacturing intelligence。Flexible Services and Manufacturing Journal,25(3),367-388。  new window
17.Chien, C. F.、Hsu, S. C.、Chen, Y. J.(2013)。A system for online detection and classification of wafer bin map defect patterns for manufacturing intelligence。International Journal of Production Research,51(8),2324-2338。  new window
18.Chien, C. F.、Liu, C. W.、Chuang, S. C.(2015)。Analysing semiconductor manufacturing big data for root cause detection of excursion for yield enhancement。International Journal of Production Research。  new window
19.許嘉裕、簡禎富、林國義、簡禎裕(20100300)。Data Mining for Yield Enhancement in TFT-LCD Manufacturing: an Empirical Study。工業工程學刊,27(2),140-156。new window  延伸查詢new window
20.許嘉裕、簡禎富、陳培穠(20120700)。Manufacturing Intelligence for Early Warning of Key Equipment Excursion for Advanced Equipment Control in Semiconductor Manufacturing。工業工程學刊,29(5),303-313。new window  new window
21.Kawachi, G.、Kimura, E.、Wakui, Y.、Konishi, N.、Yamamoto, H.、Matsukawa, Y.、Sasano, A.(1994)。A novel technology for a-Si TFT-LCD's with buried ITO electrode structure。IEEE Transaction on Electron Devices,41(7),1120-1124。  new window
22.Liu, C. W.、Chien, C. F.(2013)。An intelligent system for wafer bin map defect diagnosis: an empirical study for semiconductor manufacturing。Engineering Applications of Artificial Intelligence,26(5),1479-1486。  new window
23.Saeki, H.、Ikeno, M.、Suzuki, S.、Kawashima, H.、Uematsu, S.(1985)。Effect of microlens array for MOS color imager。IEEE Transaction on Customer Electronics,31(2),88-95。  new window
24.Tseng, D. C.、Chung, I. L.、Tsai, P. L.、Chou, C. M.(2011)。Defect classification for LCD color filters using neural-network decision tree classifier。International Journal of Innovative Computing, Information and Control,7(7A),3695-3707。  new window
25.Tu, K. K. W.、Lee, J. C. S.、Lu, H. H. S.(2009)。A novel statistical method for automatically partitioning tools according to engineers' tolerance control in process improvement。IEEE Transactions on Semiconductor Manufacturing,22(3),373-380。  new window
26.Yu, H. C.、Lin, K. Y.、Chien, C. F.(2014)。Hierarchical indices to detect equipment condition changes with high dimensional data for semiconductor manufacturing。Journal of Intelligent Manufacturing,25(5),933-943。  new window
27.簡禎富、林昀萱、鄭仁傑(20080600)。建構模糊決策樹及其在有交互作用之半導體資料之資料挖礦以提昇良率之研究。品質學報,15(3),193-210。new window  延伸查詢new window
28.Braha, D.、Shmilovici, A.(2003)。On the use of decision tree induction for discovery of interactions in a photolithographic process。IEEE Transactions on Semiconductor Manufacturing,16(4),644-652。  new window
29.Chien, C.-F.、Chen, L. F.(2007)。Using rough set theory to recruit and retain high-potential talents for semiconductor manufacturing。IEEE Transactions on Semiconductor Manufacturing,20(4),528-541。  new window
30.Chien, C.-F.、Hsu, C. Y.(2006)。A novel method for determining machine subgroups and backups with an empirical study for semiconductor manufacturing。Journal of Intelligent Manufacturing,17(4),429-439。  new window
31.Chien, C.-F.、Hsu, C. Y.(2011)。UNISON analysis to model and reduce step-and-scan overlay errors for semiconductor manufacturing。Journal of Intelligent Manufacturing,22(3),399-412。  new window
32.Li, W.-C.、Tsai, D.-M.(2011)。Defect inspection in low-contrast LCD images using Hough transform-based nonstationary line detection。IEEE Transactions on Industrial Informatics,7(1),136-147。  new window
33.簡禎富、林國義、許鉅秉、吳政鴻(20160300)。臺灣生產與作業管理之相關期刊文獻回顧與前瞻:從工業3.0到工業3.5。管理學報,33(1),87-103。new window  延伸查詢new window
會議論文
1.Chang, C. K.、Hsiao, Y. K.、Yang, S. Y.、Lu, K. L.(2001)。Planarization wrinkle in CIS color filter process。SPIE 2001,(會議日期: May 31-June 1)。Edinburgh。41-48。  new window
2.Agrawal, R.、Srikant, R.(1994)。Fast algorithms for mining association rules in large databases。The 20th International Conference on Very Large Data Bases。Morgan Kaufmann。487-499。  new window
圖書
1.簡禎富、許嘉裕(2014)。資料挖礦與大數據分析。前程文化公司。  延伸查詢new window
2.陳榕庭(2007)。半導體封裝與測試工程--CMOS影像感測器實務。台北:全華圖書股份有限公司。  延伸查詢new window
3.Crewson, P.(2006)。Applied Statistics Handbook。ACAStat Software。  new window
4.Greenwood, Priscilla E.、Nikulin, Michael S.(1996)。A Guide to Chi-Squared Testing。New York:John Wiley & Sons。  new window
5.Cramér, H.(1946)。Mathematical Methods of Statistics。Princeton:Princeton University Press。  new window
 
 
 
 
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