期刊論文| 1. | Huang, Huei-Li、Lin, Chin-Chia(1977)。Temperature Distribution, Temperature Gradient and Current Crowding: The Macroscopic Driving Force for Electromigration。Japanese Journal of Applied Physics，16(5)，723-728。   |
| 2. | Chaug, Yi‐Shung、Huang, Huei Li(1976)。Temperature distribution on thin‐film metallizations。Journal of Applied Physics，47(5)，1775-1779。 |
| 3. | Agarwala, B. N.、Attardo, M. J.、Ingraham, A. P.(1970)。Dependence of electromigration‐induced failure time on length and width of aluminum thin‐film conductors。Journal of Applied Physics，41(10)，3954-3960。 |
| 4. | Ohring, Milton(1971)。Electromigration damage in thin films due to grain boundary grooving processes。Journal of Applied Physics，42(7)，2653-2661。 |
| 5. | Chaug, Yi‐Shung、Huang, Huei Li(1975)。Cracked-stripe resistance and current crowding effect。Japanese Journal of Applied Physics，14(2)，267-271。 |
| 6. | Chaug, Yi‐Shung、Huang, Huei Li(1978)。Current crouding and flux divergence in defected stripe。Journal of Applied Physics，49(6)，3311-3316。 |
| 7. | Blech, L. A.、Meieran, E. S.(1969)。Electromigration in Thin Al Films。Journal of Applied Physics，40。 |
| 8. | Rosenberg, R.、Berenbaum, L.(1968)。Resistance monitoring and effects of nonadhesion during electromigration in aluminum films。Applied Physics Letters，12(5)，201-204。 |
| 9. | Huang, Huei Li、Chang, Chi-Yang(1973)。Electromigration Mechanisms in Thin Film Conductors。Chinese Journal of Physics，11(1)，18-32。 |