| 期刊論文| 1. | Tong, L. I.、Su, C. T.、Wang, C. H.(1997)。The optimization of multi-response problems in Taguchi method。International Journal of Quality and Reliability Management，14(4)，367-380。   | | 2. | Baranyi, A. D.、Seto, L.、Chang, S. K.(1998)。Plasma Cleaning to Improve Wire Bonds。Electronic Packaging and Production，12-16。 | | 3. | Ganesan, G. S.、Lewis, G.、Berg, H. M.(1994)。Characterizing Organic Contamination in IC Package Assembly。International Journal of Microcircuits Electronics Packaging，17(2)，152-160。 | | 4. | Kim, B.、Park, S.(2001)。An Optimal Neural Network Plasma Molde: A Casy Study。Chemometrics and Intelligent Laboratory Systems，56，30-50。 | | 5. | Kim, B.、Park, S.(2003)。Plasma Diagnosis by Recognizing in Suit Data Using a Modular Backpropagation Network。Chemometrics and Intelligent Laboratory Systems，65，231-240。 | | 6. | Kim, B.、Kim, D. W.、Park, G. T.(2005)。Prediction of Plasma-induced DC Bias Using Polynomial Neural Network。Vacuum，79，111-118。 | | 7. | Lee, C.、Gopalakrishnan, R.、Nyunt, K.、Wong, A.、Tan, R. E.、Ong, J. W.(1999)。Plasma Cleaning of Plastic Ball Grid Array Package。Microelectronics Reliability，39，97-105。 | | 8. | Moser, E. M.、Faller, C. H.、Pietrzko, S.、Eggimann, F.(1999)。Modeling the Function Performance of Plasma Polymerized Thin Films。Thin Solid Films，335-356，49-54。 | | 9. | O'Kane, D. F.、Mittal, K. L.(1974)。Plasma Cleaning Metal Surfaces。Journal of Vacuum Science and Technology，11(3)，567-569。 | | 10. | Yang, Steve L.、Bernstein, J. B.、Leong, K. C.(2002)。Effect of the Plasma Cleaning Process on Plastic Ball Grid Array Package Assembly Reliability。IEEE Transactions on Electronics Packaging Manufacturing，25(2)，91-99。 | | 11. | Su, C. T.、Chiang, T. L.(2003)。Optimizing the IC Wire Bonding Process Using a Neural Networks/Genetic Algorithms Approach。Journal of Intelligent Manufacturing，14，229-238。 | 會議論文| 1. | Kim, S.(1991)。The Role of Plastic Adhesion in IC Performance。0。 | | 2. | Schrader, M. E.(1979)。Surface Contamination Detection through Wettability Measurements。0。697-712。 | | 3. | Wong, C. P.、McBride, R.(1994)。Pre-encapsulation Cleaning Methods and Control for Microelectronics Packaging。0。121-133。 | | 4. | Yoshida, O.、Okabe, N.、Nagayama, S.、Yamagischi, R.、Murakami, G.(1989)。Improvement of Moisture Resistance in Plastic Encapsulants MOS-IC by Surface Finishing Copper Leadframe。0。464-471。 | 學位論文| 1. | 潘國松(2003)。Research in the Strength Improvement of Golden Wire Bonding in BGA by the Plasma Cleaning，0。 | 圖書| 1. | Goldberg, D. E.(1989)。Gene Algorithm in Search, Optimization and Machine Learning。New York：Massachusetts：Addison-Wesley。 | | 2. | Phadke, M. S.(1989)。Quality Engineering Using Robust Design。New Jersey：Prentice-Hall。 | | 3. | Holland, J. H.(1975)。Adaptation in Natural and Artificial Systems: An Introductory Analysis with Application to Biology, Control, and Artificial Intelligence。MI：University of Michigan Press。 | | 4. | Fairfield, C.。Optimization of Ion and Electron Properties in IC Packaging Applications。Optimization of Ion and Electron Properties in IC Packaging Applications。0。 | | 5. | Freeman, J.、Skapura, D.(1991)。Neural Networks。Neural Networks。New York, NY。 | | 6. | Harman, G. G.(1991)。Reliability and Yield Problems of Wire Bonding in Microelectronics。Reliability and Yield Problems of Wire Bonding in Microelectronics。0。 | | 7. | Plasma Surface Modification of Polymers: Relevance to Adhesion。Plasma Surface Modification of Polymers: Relevance to Adhesion。Utrecht, Netherlands。 | | 8. | White, M. L.(1970)。The Detection and Control of Organic Contamination on Surfaces。Clean Surfaces。New York, NY。 | |