Wafer die yield is a key index of business profit at the semiconductor industry as the development of the semiconductor production technology and wafer size increases. Thus, the wafer die yield prediction models become a very important issue to this industry. Early researches mostly use such parameters as defects on wafer and wafer size cooperate with a regular distribution, such as Poisson distribution or Negative Binomial distribution, to establish the wafer die yield prediction model. However, these prediction methods of yield models might not be suitable and accurate for all semiconductor manufacturers. In this study, we discover the connection between the wafer acceptance test (WAT) data and circuit probe yield. A simple, efficient and accurate wafer die yield prediction model with less WAT parameters is proposed. Various Neural Network analysis techniques such as Backpropagation Neural Network (BPNN), General Regression Neural Network (GRNN) and Group Method of Data Handling (GMDH) are analyzed and compared. Our Result shows Backpropagation Neural Network is valid and efficient in selecting WAT parameters. The GMDH is recommended for establishing the model because of its ability to catch data pattern with less variables and higher accuracy.