在半導體製程中往往會在製程中穿插一些品質檢驗的項目，而如何確保這些品質檢驗的執行能確實檢驗出不良的製程缺點則是工程人員的最大課題，本文將選擇半導體製程中的拉球測試作探討。影響拉球測試的結果有許多，本實驗將排除其他人為、機台等因素，找出最佳化的拉球參數。實驗方法則使用業界中最廣泛使用的田口方法，在田口方法中不僅運用符合參數條件的直交表找出最佳參數供拉球測試執行，也將所有拉球測試參數分為三類，分別為縮小變異、調整品質特性及降低成本，亦可作為後續的製程變更的參考依據。

In the process of semiconductor, quality inspection processes are usually performed during manufacturing line. To make sure that the process defect be detected when quality inspection processes performed is engineers' responsibility. This paper will focus on ball pull test of semiconductor process. In spite of many factors will affect the result of ball pull, this experiment obviate other minor factors such as personal equation and machine and come out the most optimal parameters. The method executed in this experiment is Taguchi Method, which is applied most extensively in the manufacturing industry. In the Taguchi Method, we not only find out the optimal parameter of ball pull test, also classify the critical parameter into three categories, which are reduce deviation, adjust quality characteristics and decrease cost. The result could be the reference principles of the further processes changing.