The appearance of 3C (computer, communication, consumer electronic) electronic products has been considered as a critical attribute to attract consumers in the past decade. Moreover, 3C electronic enterprises with own brands are trying hard to meet the requirements such as user-friendly interface and eco-environmental materials for increasing the revenue and market share. Bamboo had been known as a flexible and green raw-material worldwide for many years. However, there are no bamboomade applications in any 3C electronic products due to its manufacturing process to achieve satisfactory specifications. The innovative manufacturing process of bamboo injection molding on the appearance of a 3C product suffered from a crucial quality issue, that is, bamboo deformation due to the difference between shrinkage of plastic and its inherent material characteristics. The concept is similar to IMR (in-mold decoration by roller) process. The objective of this article is to propose an innovative and robust bamboo injection molding process by using skills such as measurement system analysis, the Taguchi method, process capability index, and TRIZ. In this study, the detailed experimental process and satisfactory result are demonstrated and given. The exploited approach concerning bamboo is a valuable outcome and reference for further advanced implementations in electrical industry and others.