本研究應用複合灰關聯田口方法以最佳化具有多品質特性之迴焊溫度曲線。表面黏著迴焊製程為電子組裝業界最重要之焊接方法，利用熱傳導以形成基板與電子元件間穩健焊點（solder joint）。但若採用一個不佳的迴焊溫度曲線，可能造就諸多焊接缺點（例如空焊、錫球、短路、墓碑等），亦影響電子產品可靠度與產品良率甚巨。為了解決上述問題，本研究首先運用一個L_(18）（2^1×3^7）實驗設計用以蒐集結構化製程資訊，繼而利用灰關聯分析建立製程輸出項與理想迴焊狀態間關聯性，再將多品質特性轉換為單一績效指標並利用田口方法最佳化迴焊溫度參數，最後藉由驗證實驗評估製程參數最佳化績效與實用性，顯示研究成果可改善案例工廠之迴焊品質績效並提升電子產品良率。

This paper presents an application of a grey-Taguchi method to optimize a reflow thermal profiling operation with multiple characteristics. Reflow soldering is a dominant means used to melt solder paste and to form robust solder joints between surface mount devices (SMDs) and solder pads of printed circuit board (PCB) in surface mount assembly (SMA). The thermal profile setting is a significant variable that affects production yield in SMA. An inappropriate reflow thermal profile can cause many soldering defects (e.g., voiding, balling, bridging, tombstoning, etc.) and jeopardize product reliability. In this study, an L_(18) (2^1×3^7) experimental design was conducted to collect structured data, and followed by establishing the degree of relationship between each reflow soldering response and the idea condition using the grey relational analysis (GRA). The multiple quality characteristics were then transformed into a single performance index prior to optimizing reflow soldering parameters by the Taguchi method. The performance of the proposed methodology is finally evaluated through confirmation experiments to confirm it practicability. The evaluations show that the proposed optimization method can significantly improve reflow soldering performance compared to the heating settings used for mass production.