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題名：建構半導體晶圓廠整廠績效指標架構與全面資源管理
書刊名：管理與系統
作者：簡禎富／林國義
作者(外文)：Chien, Chen-fu／Lin, Kuo-yi
出版日期：2016
卷期：23:4
頁次：頁451-474
主題關鍵詞：半導體產業；績效評估；決策分析；龍捲風圖；全面資源管理；Semiconductor industry；Performance evaluation；Decision analysis；Tornado diagram；Total resource management
原始連結：連回原系統網址new window
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  • 被引用次數被引用次數:期刊(2) 博士論文(0) 專書(0) 專書論文(0)
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  • 共同引用共同引用:86
  • 點閱點閱:40
半導體產業依據摩爾定律持續以進行製程技術提升外，還需要製造管理技術和資源管理效益提升才能面對激烈的產業競爭。然而，既有研究偏重於現場管理與生產力的提升，少有針對整廠績效評估架構和個別指標的連結。本研究目的為建構半導體晶圓廠整廠績效指標架構，由文獻回顧與專家訪談，整理整廠績效指標需具備的要素，探討指標之影響關係以建構整廠績效指標架構，供決策者全面管理半導體晶圓廠，發揮全面資源管理優勢以提昇競爭力。本研究以某半導體企業為實證，針對市場需求、原物料成本的變化情形，利用龍捲風圖進行多個單因子的敏感度分析，探討各情況下的指標改善方向及其影響，提供管理者在不同情況時的決策建議及其重點改善方向，實證研究結果已證明本研究效度。
Semiconductor industry has been following the Moore's Law (Moore, 1965) that the number of transistors fabricated on a wafer will be doubled every 12 or 24 months to advance the technology. However, most studies focus on the optimization of performance indices dividedly which lack of the view of fab as a whole. This study aims to construct a semiconductor overall fab performance indices framework. The performance index hierarchy structure can sort out the relationships between indices to link with overall effectiveness for fab operations. In particular, we conduct an empirical study in a leading semiconductor company for validation. Through sensitivity analysis of tornado diagram, empirical decision rules for different important key performance indices can be derived for different situations to support decision makers for effective operation management. The results have shown practical viability of the proposed approach.
期刊論文
1.簡禎富、胡志翰(20111200)。全面資源管理架構：以晶圓廠為實證。品質學報，18(6)，581-607。new window  延伸查詢new window
2.Chen, Wen-Chih、Chien, Chen-Fu(2011)。Measuring relative performance of wafer fabrication operations: a case study。Journal of Intelligent Manufacturing，22(3)，447-457。  new window
3.Chien, C.-F.、Chen, W.-C.、Hsu, S.-C.(2010)。Requirement estimation for indirect workforce allocation in semiconductor manufacturing。International Journal of Production Research，48(23)，6959-6976。  new window
4.Leachman, R. C.、Ding, S.、Chien, C.-F.(2007)。Economic efficiency analysis of wafer fabrication。IEEE Transactions on Automation Science and Engineering，4(4)，501-512。  new window
5.Chien, C.-F.、Chen, H.-K.、Wu, J.-Z.、Hu, C.-H.(2007)。Construct the OGE for promoting tool group productivity in semiconductor manufacturing。International Journal of Production Research，45(3)，509-524。  new window
6.Chien, C.-F.、Wang, W. C.、Cheng, J. C.(2007)。Data mining for yield enhancement in semiconductor manufacturing and an empirical study。Expert Systems with Applications，33(1)，192-198。  new window
7.Howard, R. A.(1988)。Decision analysis: Practice and promise。Management Science，34(6)，679-695。  new window
8.周明璇、陳文智、簡禎富(20130800)。建構半導體廠跨廠績效評估以提昇資源分配決策品質之研究。品質學報，20(4)，427-444。new window  延伸查詢new window
9.Wu, J. Z.(2013)。Inventory write-down prediction for semiconductor manufacturing considering inventory age, accounting principle, and product structure with real settings。Computers & Industrial Engineering，65(1)，128-136。  new window
10.Moore, Gordon E.(1965)。Cramming more components onto integrated circuits。Electronics，38(8)，114-117。  new window
11.簡禎富、陳勁甫、林國義(20130400)。在新竹科學工業園區及週邊規劃研究園區之研究。管理與系統，20(2)，227-255。new window  延伸查詢new window
12.Chen, W.-C.、Chien, C.-F.(2011)。Evaluating Capacity Pooling Strategy in Semiconductor Manufacturing: A Productivity Perspective Study。International Journal of Production Research，49(12)，3635-3652。  new window
13.Hsu, C.-Y.、Chien, C.-F.、Lin, K.-Y.、Chien, C.-Y.(2010)。Data Mining for Yield Enhancement in TFT-LCD Manufacturing and an Empirical Study。Journal of the Chinese Institute of Industrial Engineers，27(2)，140-156。  new window
14.Wu, Jei-Zheng、Chien, Chen-Fu(2008)。Modeling Strategic Semiconductor Assembly Outsourcing Decisions Based on Empirical Settings。OR Spectrum，30(3)，401-430。  new window
15.Chien, C.-F.、Hsu, C. Y.(2014)。Data mining for optimizing IC feature designs to enhance overall wafer effectiveness。IEEE Transactions on Semiconductor Manufacturing，27(1)，71-82。  new window
16.Yu, H. C.、Lin, K. Y.、Chien, C. F.(2014)。Hierarchical indices to detect equipment condition changes with high dimensional data for semiconductor manufacturing。Journal of Intelligent Manufacturing，25(5)，933-943。  new window
17.Leachman, R. C.、Hodges, D. A.(1996)。Benchmarking semiconductor manufacturing。IEEE Transactions on Semiconductor Manufacturing，9(2)，158-169。  new window
18.簡禎富(20110500)。全面資源管理以提昇卓越經營。品質月刊，47(5)，8-12。  延伸查詢new window
19.Braglia, M.、Frosolini, M.、Zammori, F.(2009)。Overall Equipment Effectiveness of a Manufacturing Line (OEEML) An Integrated Approach to Assess Systems Performance。Journal of Manufacturing Technology Management，20(1)，8-29。  new window
20.Chien, C.-F.、Chu, P.-C.、Zhao, L.(2015)。Resource Effectiveness (ORE) Indices for Total Resource Management and Case Studies。International Journal of Industrial Engineering: Theory, Applications and Practice，22(5)，618-630。  new window
21.Chien, Chen-Fu、Diaz, Alejandra Campero、Lan, Yu-Bin(2014)。A Data Mining Approach for Analyzing Semiconductor MES and FDC Data to Enhance Overall Usage Effectiveness (OUE)。International Journal of Computational Intelligence Systems，7(2)，52-65。  new window
22.Chien, C.-F.、Hsu, C.-Y.、Chang, K.-H.(2013)。Overall Wafer Effectiveness (OWE): A novel industry standard for semiconductor ecosystem as a whole。Computers and Industrial Engineering，65(1)，117-127。  new window
23.Chien, C.-F.、Hsu, S. C.、Chen, C. P.(1999)。An Iterative Cutting Procedure for Determining the Optimal Wafer Exposure Pattern。IEEE Transactions on Semiconductor Manufacturing，12(3)，375-377。  new window
24.Chien, C.-F.、Hsu, S. C.、Deng, J. F.(2001)。A Cutting Algorithm for Optimizing the Wafer Exposure Pattern。IEEE Transactions on Semiconductor Manufacturing，14(2)，157-162。  new window
25.Chien, C.-F.、Hu, C.-H.、Hu, Y.-F.(2016)。Overall Space Effectiveness (OSE) for Enhancing Fab Space Productivity。IEEE Transactions on Semiconductor Manufacturing，29(3)，239-247。  new window
26.簡禎富、林國義(20120300)。Manufacturing Intelligence for Hsinchu Science Park Semiconductor Sales Prediction。工業工程學刊，29(2)，98-110。new window  延伸查詢new window
27.Chien, C.-F.、Lin, K. Y.、Kerh, R.、Yu, A. P. I.(2016)。Data-driven innovation to capture user-experience product design: An empirical study for notebook visual aesthetics design。Computers & Industrial Engineering，99，162-173。  new window
28.Chien, Chen-Fu、Lin, Kuo-Yi、Yu, Annie Pei-I(2014)。A User-experience of tablet operating system: An experimental investigation of Windows 8, iOS 6, and Android 4.2。Computers & Industrial Engineering，73(1)，75-84。  new window
29.Chien, C.-F.、Peng, J.-T.、Yu, H.-C.(2016)。Building energy saving performance indices for cleaner semiconductor manufacturing and an empirical study。Computers & Industrial Engineering，99，448-457。  new window
30.de Ron, A. J.、Rooda, J. E.(2005)。Equipment Effectiveness: OEE Revisited。IEEE Transactions on Semiconductor Manufacturing，18(1)，190-196。  new window
31.Hsu, C. Y.(2014)。Integrated Data Envelopment Analysis and Neural Network Model for Forecasting Performance of Wafer Fabrication Operations。Journal of Intelligent Manufacturing，25(5)，945-960。  new window
32.Huang, S. H.、Dismukes, J. P.、Shi, J.、Su, Q.、Razzak, M. A.、Bodhale, R.、Robinson, D. E.(2003)。Manufacturing Productivity Improvement using Effectiveness Metrics and Simulation Analysis。International Journal of Production Research，41(3)，513-527。  new window
33.Jeong, K. Y.、Phillips, D. T.(2001)。Operational Efficiency and Effectiveness Measurement。International Journal of Operations and Production Management，21(11)，1404-1416。  new window
34.Kuo, C.-J.、Chien, C.-F.、Chen, J.-D.(2011)。Manufacturing Intelligence to Exploit the Value of Production and Tool Data to Reduce Cycle Time。IEEE Transactions on Automation Science and Engineering，8(1)，103-111。  new window
35.Leachman, R. C.(1997)。Closed-loop Measurement of Equipment Efficiency and Equipment Capacity。IEEE Transactions on Automation Science and Engineering，10(1)，84-97。  new window
36.Lin, K. Y.、Chien, C.-F.、Kerh, R.(2016)。UNISON Framework of Data-Driven Innovation for Extracting User Experience of Product Design of Wearable Devices。Computers & Industrial Engineering，99(2)，487-502。  new window
37.Lin, K. Y.、Hsu, C. Y.、Yu, H. C.(2014)。A Virtual Metrology Approach for Maintenance Compensation to Improve Yield in Semiconductor Manufacturing。International Journal of Computational Intelligence Systems，7(2)，66-73。  new window
38.Muchiri, P.、Pintelon, L.(2008)。Performance Measurement using Overall Equipment Effectiveness (OEE): Literature Review and Practical Application Discussion。International Journal of Production Research，46(13)，3517-3535。  new window
39.Muthiah, K. M. N.、Huang, S. H.(2007)。Overall Throughput Effectiveness (OTE) Metric for Factory-level Performance Monitoring and Bottleneck Detection。International Journal of Production Research，45(20)，4753-4769。  new window
40.Oechsner, R.、Pfeffer, M.、Pfitzner, L.、Binder, H.、Muller, E.、Vonderstrass, T.(2003)。From Overall Equipment Efficiency (OEE) to Overall Fab Effectiveness (OFE)。Material Science and Semiconductor Processing，5(4)，333-339。  new window
41.Scott, D.、Pisa, R.(1998)。Overall Factory Effectiveness Prolong Moore's Law?。Solid State Technology，41(3)，75-82。  new window
42.Wu, J.-Z.、Hao, X.-C.、Chien, C.-F.、Gen, M.(2012)。A Novel Bi-Vector Encoding Genetic Algorithm for the Simultaneous Multiple Resources Scheduling Problem。Journal of Intelligent Manufacturing，23(6)，2255-2270。  new window
43.簡禎富、林國義、許鉅秉、吳政鴻(20160300)。臺灣生產與作業管理之相關期刊文獻回顧與前瞻：從工業3.0到工業3.5。管理學報，33(1)，87-103。new window  延伸查詢new window
會議論文
1.Bonal, J.、Ortega, C.、Rios, L.、Aparicio, S.、Fernandez, M.、Rosendo, M.、Sanchez, A.、Malvar, S.(1996)。Overall Fab Efficiency [Semiconductor Manufacturing]。Advanced Semiconductor Manufacturing Conference and Workshop，49-52。  new window
圖書
1.簡禎富(2015)。決策分析與管理--全面決策品質提升之架構與方法。台北：雙葉書廊。new window  延伸查詢new window
2.Walsh, C.、何霖(2007)。比率管理全書--解讀、串聯推動企業運作的關鍵數字。台北：臉譜文化事業股份有限公司。  延伸查詢new window
3.Nakajima, S.(1988)。Introduction to Total Productive Maintenance。Cambridge, MA：Productivity Press。  new window
其他
1.(2000)。Standard for Definition and Measurement of Equipment Productivity(SEMI E79-0200)。，Mountain View, CA：Semiconductor Equipment and Material International。  new window
2.(2007)。Guide for Definition and Calculation of Overall Factory Efficiency (OFE) and Other Associated Factory-Level Productivity Metrics(SEMIE 124-1107)。，San Jose, CA：Semiconductor Equipment and Material International。  new window
圖書論文
1.李雪如(2009)。簡禎富：決策分析創造半導體最佳生產效益。2009經濟部產業貢獻獎--研發台灣科技新未來。台北：經濟部技術處。  延伸查詢new window
 
 
 
 
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