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題名:半導體產業發明人流動與技術相似度關連之研究─技術外溢與社會網絡分析之應用
作者:羅德維
作者(外文):Te-Wei Lo
校院名稱:雲林科技大學
系所名稱:企業管理博士班
指導教授:賴奎魁
學位類別:博士
出版日期:2011
主題關鍵詞:技術重疊社會網絡分析技術外溢流動發明人technological overlaptechnological spillovertransferred inventorsocial network analysis
原始連結:連回原系統網址new window
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高科技產業研發人員轉任於各企業間是司空見慣的事。轉任後研發人員極可能將原服務企業習得的技術在無形中應用到新雇用企業的研發來,使得前後兩家公司擁有相似的技術,但這樣的技術外溢過程宛若黑盒子般難被呈現。從近三十年的專利資料中,本研究在社會網絡分析法的協助下,重建了形同兩個網絡的新竹半導體產業群聚過去發明人移動及技術重疊歷程的軌跡。兩者經QAP迴歸檢驗後顯示,廠商間流動發明人網絡確實與廠商間技術重疊網絡有正向關係,流動發明人促進了廠商間的技術相似。再深入分析其影響模式,廠商表現在流動發明人網的重要特徵值顯著且正向地影響在技術重疊網的。以上結果顯示了廠商發明人流動性與廠商間的技術相似性之間有相互關連的現象,存在著極高的技術外溢可能性。
Personnel involved in high-tech R&D commonly move between enterprises, bringing with them technology obtained elsewhere. This leads to an imperceptible circulation of analogous technology among different companies. Unfortunately, this so-called technological spillover is difficult to detect. This study combined social network analysis with patent data covering nearly 30 years to construct the networks that involve the mobility of inventors and technological overlap in the Hsinchu semiconductor industry. Regression analysis using quadratic assignment procedures reveals that the network within which inventors migrate has a positive impact on the network technological overlap. Further analysis clarified the positive relationship between the mobility of inventors and technological overlap in terms of the organizational network characteristics. This confirms a process of co-evolution between technological overlap and the mobility of inventors, which may have a highly likely spillover.
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